PASTE
Next-generation silver paste engineered for maximum solar cell efficiency. From PERC to HJT, TOPCon to bifacial — precision metallization solutions for the modern solar industry.
PRECISION FORMULATION ACROSS CELL ARCHITECTURES
FOUR PASTE SYSTEMS. ONE MISSION.
Engineered for the full spectrum of solar cell architectures — every formulation precision-tuned for peak performance, minimal silver consumption, and reliable throughput.
SA-FS Series — Front-Side Metallization
Ultra-fine-line front-side paste engineered for superior finger conductivity and minimal shading loss. Optimized for print widths down to 28μm with excellent aspect ratios and low contact resistance on n-type and p-type wafers.
SA-BS Series — Back-Side Silver/Aluminum
High-adhesion rear-side metallization paste for solder-joint reliability and low bow on thin wafers. Engineered for tabbing compatibility with outstanding long-term adhesion in damp-heat and thermal cycling conditions.
SA-HJT Series — Low-Temperature HJT Paste
Specifically formulated for heterojunction (HJT) cell architecture using indium tin oxide (ITO) contact layers. Cures at 150–200°C preserving the sensitive amorphous silicon passivation while delivering outstanding conductivity.
SA-TPCon — PERC / TOPCon Optimized
Dual-function formulation supporting both PERC and emerging TOPCon cell structures. Demonstrates excellent tunneling oxide contact behaviour with minimized silver crystallite penetration and optimized firing windows for flexible production.
PRECISION AT THE NANOSCALE
Engineered Silver Flake Morphology
Our proprietary silver flake synthesis achieves tight particle size distribution (D50: 1.2–2.5μm) with optimized aspect ratios for maximum inter-particle contact and conductivity.
Advanced Glass Frit Chemistry
Lead-free, RoHS-compliant glass frit systems engineered for precise etching of anti-reflection coatings (ARC), ensuring excellent ohmic contact formation at optimized firing temperatures.
Rheology-Optimized Vehicles
Proprietary organic binder and solvent system provides thixotropic flow behaviour ideal for high-speed screen printing with superior print definition and minimal bleeding.
Ultra-Low Contact Resistivity
Precision-engineered contact formation delivers contact resistivity below 1.2 mΩ·cm² on high-sheet-resistance emitters (>130 Ω/sq), maximizing fill factors.
Industry Standard vs. Argenixx Nano Tech Paste
CALCULATE YOUR METALLIZATION SAVINGS
Model your annual silver consumption reduction and cost savings by migrating to Argenixx advanced fine-line silver paste.
WHERE WE PERFORM
Argenixx pastes are deployed across every major solar cell and module production context worldwide.
GW-Scale Cell Manufacturing
High-throughput screen printing lines producing 4,000+ wafers/hour. Our paste delivers consistent print quality at line speeds exceeding 3,600 WPH with no nozzle clogging or print defects.
Module Assembly
Rear-side pastes engineered for reliable tabbing and stringing interconnection. Superior solderability ensures long module service life under IEC 61215 reliability testing.
R&D and Pilot Lines
Custom rheology formulations supplied in pilot quantities (100g–5kg) for academic institutions, cell R&D centers, and next-generation architecture prototyping.
Bifacial Cell Architecture
Dual-sided metallization pairing front-side finger pastes with high-transparency rear-side grid pastes to maximize rear irradiance harvest without shading penalty.
Thin-Wafer Processing
Low-stress firing kinetics and thermal expansion matched pastes designed specifically to eliminate micro-cracking and wafer bow on ultra-thin (<130μm) wafers.
Harsh Environment Modules
Enhanced moisture-barrier glass frit chemistry preventing silver migration and PID (potential-induced degradation) in desert, tropical, and floating-PV marine environments.
ENGINEERED FOR EXCELLENCE
Four core pillars that set Argenixx metallization pastes apart from commodity chemical suppliers.
Peak Efficiency
Achieved with SA-TPCon on n-type TOPCon in independent testing at Fraunhofer ISE.
Silver Purity
Every batch assayed. Traceability from mine to module with full chain-of-custody documentation.
Lead-Free Compliant
All formulations exceed EU RoHS, REACH, and halogen-free standards for global market access.
Batch Consistency
Tight viscosity and solids control across all batches. COA provided with every shipment.
PIONEERING SOLAR METALLIZATION AT THE ATOMIC LEVEL
Argenixx was established to deliver world-class conductive silver paste solutions for global solar cell manufacturers. Led by veterans in advanced metallurgy and industrial cleanroom engineering.
“True solar innovation begins at the nano-scale: where precision chemistry unlocks the clean energy transition.”
Argenixx Corporate Philosophy
Manhar Dhodiya
“Our purpose is to manufacture domestic high-purity metallization pastes that exceed global benchmarks in efficiency, consistency, and reliability.”
Steers executive governance, long-term metallurgical formulation roadmap, and strategic industrial joint ventures across the photovoltaic value chain.
THE FUTURE OF METALLIZATION
Solar technology evolves rapidly. Our R&D pipeline ensures Argenixx paste solutions stay ahead of every emerging cell architecture.
TOPCon Paste Optimization
Full commercial release of SA-TPCon with certified >24.5% efficiency on mass-production TOPCon lines. Partnership with 3 GW-scale manufacturers.
Back-Contact Cell Metallization
New SA-IBC formulation for interdigitated back-contact cells — eliminating front-surface shading entirely with complete rear metallization.
Perovskite-Compatible Pastes
Ultra-low temperature (<120°C) silver paste compatible with perovskite absorber layers — enabling the tandem cell revolution without compromising the perovskite junction.
Copper-Silver Hybrid Paste
Dramatically reducing silver content through copper-silver composite technology — maintaining conductivity while cutting material cost by up to 60%.
COMPARATIVE SPECIFICATION MATRIX
Direct parameter comparison across all four Argenixx production-grade metallization paste formulations.
| Parameter | SA-FS Front-Side | SA-BS Back-Side | SA-HJT Low-Temp |
SA-TPCon
Flagship
|
|---|---|---|---|---|
REQUEST TECHNICAL DATASHEETS OR EVALUATION SAMPLES
Our technical metallization engineers are available to review your line specifications and configure custom paste batches for wafer testing.
Argenixx Nano Tech Pvt Ltd.
OPP, Shitala Mata Mandir
Kansarwad Corner, Mota Bazar
Navsari - 396445, Gujarat, India
Argenixx Nano Tech Pvt Ltd.
1364 GOVING NAGAR
Behind - Shiv Parvati krupa. Society
Jamalpore
Navsari - 396445, Gujarat, India